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CÔNG TY TNHH CÔNG NGHỆ ZIITEK VIỆT NAM
VIETNAM ZIITEK TECHNOLOGY CO.,LTD Vietnam Ziitek Technology Company Limited
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TIF100-40-11U Thermal Pad For GPU CPU Chip

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TIF100-40-11U Thermal Pad For GPU CPU Chip

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Brand Name : Ziitek

Model Number : TIF100-40-11U

Certification : UL and RoHs

Place of Origin : Vietnam

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 24*13*12cm cartons

Products name : Thermal Pad For GPU CPU Chip

Thermal Conductivity : 4.0W/mK

Density : 3.15g/cm³

Keywords : Thermal Pad

Color : Gray

Hardness : 27 Shore 00

Dielectric Breakdown Voltage : >5500VAC

Application : GPU CPU Chip

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Thermal Pad For GPU CPU Chip

The TIF™100-40-11U is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF100-40-11U is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF100-40-11U Thermal Pad For GPU CPU Chip

Features:


> Good thermal conductive: 4.0W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> RoHS compliant
> UL recognized
> Moldability for complex parts
> Naturally tacky needing no further adhesive coating


Applications:


> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> IT infrastructure
> GPS navigation and other portable devices
> CD-Rom, DVD-Rom cooling
> LED Power Supply
> LED Controller
> LED Ceilinglamp

Typical Properties of TIF100-40-11U Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 3.15g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 27 Shore 00 ASTM 2240
Continuos Use Temp -40 to 160℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X10¹² ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 4.0W/m-K ASTM D5470


Products Thickness:
0.020 inch to 0.200 inch(0.5mm to 5.0mm)

Products Size:

8"*16"(203mm*406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.

Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
TIF100-40-11U Thermal Pad For GPU CPU Chip
Company Profile

With professional R&D capabilities and over 19 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.


Quality TIF100-40-11U Thermal Pad For GPU CPU Chip for sale

TIF100-40-11U Thermal Pad For GPU CPU Chip Images

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